System For Constraining An Operating Parameter Of An EHF Communication Chip

ABSTRACT

An EHF communication system including an EHF communication chip. The EHF communication chip may include an EHF communication circuit having at least one controllable parameter-based module having a testable and controllable operating parameter The EHF communication chip may further include a test and trim circuit coupled to the EHF communication circuit, where the test and trim circuit includes a logic circuit having one or more memory elements, where the logic circuit is coupled to the controllable parameter-based module.

RELATED APPLICATIONS

This application claims the benefit of U.S. Provisional Application No.61/607,379, filed Mar. 6, 2012, and entitled TEST AND TRIM METHOD ANDDEVICE, which application is incorporated herein by reference in itsentirety for all purposes.

This application is a continuation of co-pending U.S. application Ser.No. 14/563,806, filed Dec. 8, 2014, and entitled EXTREMELY HIGHFREQUENCY (EHF) COMMUNICATION CONTROL CIRCUIT, which is a continuationof U.S. application Ser. No. 13/787,789, filed Mar. 6, 2013, now bearingU.S. Pat. No. 8,929,834 and entitled SYSTEM FOR CONSTRAINING ANOPERATING PARAMETER OF AN EHF COMMUNICATION CHIP, the contents of eachis incorporated by reference in its entirety.

FIELD OF THE INVENTION

The present disclosure relates to electronic systems and devices, andmore specifically to chip-based test and trim systems and devices.

BACKGROUND

Advances in semiconductor manufacturing and circuit design technologieshave enabled the development and production of integrated circuits (ICs)with increasingly higher operational frequencies. In turn, electronicproducts and systems incorporating such integrated circuits are able toprovide much greater functionality than previous generations ofproducts. This additional functionality has generally included theprocessing of increasingly larger amounts of data at increasingly higherspeeds.

Many electronic systems include multiple printed circuit boards (PCBs)upon which these high-speed ICs are mounted, and through which varioussignals are routed to and from the ICs. In electronic systems with atleast two PCBs and the need to communicate information between thosePCBs, a variety of connector and backplane architectures have beendeveloped to facilitate information flow between the boards.Unfortunately, such connector and backplane architectures introduce avariety of impedance discontinuities into the signal path, resulting ina degradation of signal quality or integrity. Connecting to boards byconventional means, such as signal-carrying mechanical connectors,generally creates discontinuities, requiring expensive electronics tonegotiate. Conventional mechanical connectors may also wear out overtime, require precise alignment and manufacturing methods, and aresusceptible to mechanical jostling.

In light of above discussion, there exists a need for improvedconnectors that maybe used in various electronic devices.

BRIEF SUMMARY

An embodiment of the present invention provides an EHF communicationsystem including an EHF communication chip. The EHF communication chipmay include an EHF communication circuit having at least onecontrollable parameter-based module having a testable and controllableoperating parameter The EHF communication chip may further include atest and trim circuit coupled to the EHF communication circuit, wherethe test and trim circuit includes a logic circuit having one or morememory elements, where the logic circuit is coupled to the controllableparameter-based module.

An alternative embodiment of the present invention provides an EHFcommunication system that includes an EHF communication circuitresponsive to a control setting, and which operates initially at aninitial EHF carrier frequency. The EHF communication system furtherincludes a test circuit configured to determine a difference between theinitial EHF carrier frequency and a preselected reference carrierfrequency, to generate a temporary control setting for the EHFcommunication circuit configured to adjust the carrier frequency of theEHF communication circuit from the initial EHF carrier frequency to anadjusted EHF carrier frequency within a preselected frequency rangeincluding the reference carrier frequency, and to apply the temporarycontrol setting to the EHF communication circuit. The EHF communicationsystem yet further includes a memory circuit coupled to the EHFcommunication circuit and configured to permanently apply the temporarycontrol setting to the EHF communication circuit.

An additional alternative embodiment of the present invention providesan EHF communication system that includes an EHF communication circuitresponsive to a control setting and operating initially at an initialEHF emissions level. The EHF communication system further includes atest circuit configured to determine a difference between the initialEHF emissions level and a preselected reference EHF emissions level, togenerate a temporary control setting for the EHF communication circuitconfigured to adjust the EHF emissions level of the EHF communicationcircuit from the initial EHF emissions level to an adjusted EHFemissions level within a preselected emissions level range of thereference EHF emissions level, and to apply the temporary controlsetting to the EHF communication circuit. The EHF communication systemyet further includes a memory circuit coupled to the EHF communicationcircuit and configured to permanently apply the temporary controlsetting to the EHF communication circuit.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

Having thus described the invention in general terms, reference will nowbe made to the accompanying drawings, which are not necessarily drawn toscale, and wherein:

FIG. 1 is side view of an EHF communication chip showing some internalcomponents, in accordance with an embodiment of the present invention;

FIG. 2 is an isometric view of the EHF communication chip of FIG. 1;

FIG. 3 is a block diagram illustrating system elements of the EHFcommunication chip, in accordance with an embodiment of the presentinvention.

FIG. 4 is functional block diagram of a portion of an illustrative EHFcommunication chip showing a test and trim circuit.

FIG. 5 is a block diagram of a portion of another illustrative EHFcommunication chip showing a test and trim circuit in relation to othercircuits; and

FIGS. 6A-6B are flow charts illustrating an exemplary method for testingand setting a parameter on an EHF communication chip having a test andtrim circuit.

DETAILED DESCRIPTION

Illustrative embodiments of the invention now will be described morefully hereinafter with reference to the accompanying drawings, in whichsome, but not all embodiments of the invention are shown. Indeed, theinvention may be embodied in many different forms and should not beconstrued as limited to the embodiments set forth herein; rather, theseembodiments are provided so that this disclosure will satisfy applicablelegal requirements. Like numbers refer to like elements throughout.

As will be appreciated by one skilled in the art, aspects of the presentinvention may be embodied as a system, method or computer programproduct. Accordingly, aspects of the present invention may take the formof an entirely hardware embodiment, an entirely software embodiment(including firmware, resident software, micro-code, etc.) or anembodiment combining software and hardware aspects that may allgenerally be referred to herein as a “circuit,” “module” or “system”.Furthermore, aspects of the present invention may take the form of acomputer program product embodied in one or more computer readablemedium(s) having computer readable program code embodied thereon.

The detrimental characteristics of conventional connectors lead todegradation of signal integrity and corresponding instability ofelectronic systems that are designed to transfer data at very highrates, which in turn limits the utility of such systems. Methods andsystems are needed for coupling discontinuous portions of high-data-ratesignal paths without the cost and power consumption associated withinsertable physical connectors and equalization circuits. Additionally,methods and systems are needed to ensure that such solutions are easilymanufactured, modular, and efficient.

Examples of such systems are disclosed in U.S. Pat. No. 5,621,913 andU.S. patent application Ser. No. 12/655,041. The disclosures of theseand all other publications referenced herein are incorporated byreference in their entirety for all purposes.

Furthermore, in today's society and ubiquitous computing environment,high-bandwidth modular and portable memory devices are being usedincreasingly. Methods are therefore desirable for ensuring security andstability of communication between and within these devices. In order toprovide improved secure high-bandwidth communications, the uniquecapabilities of EHF communications units may be utilized in innovativeand useful arrangements.

An example of an EHF communications unit is an EHF comm-link chip.Throughout this disclosure, the terms comm-link chip, comm-link chippackage, EHF communications unit, and EHF communication link chippackage will be used interchangeably to refer to EHF antennas embeddedin IC packages. Examples of such comm-link chips are described in detailin U.S. Provisional Patent Application Ser. Nos. 61/491,811, 61/467,334,and 61/485,1103, all of which are hereby incorporated in theirentireties for all purposes.

FIG. 1 is a side view of an exemplary extremely high frequency (EHF)communication chip 114 showing some internal components, in accordancewith an embodiment. As discussed with reference to FIG. 1, the EHFcommunication chip 114 may be mounted on a connector printed circuitboard (PCB) 116 of the EHF communication chip 114. FIG. 2 shows asimilar illustrative EHF communication chip 214. It is noted that FIG. 1portrays the EHF communication chip 114 using computer simulationgraphics, and thus some components may be shown in a stylized fashion.The EHF communication chip 114 may be configured to transmit and receiveextremely high frequency signals. As illustrated, the EHF communicationchip 114 can include a die 102, a lead frame (not shown), one or moreconductive connectors such as bond wires 104, a transducer such asantenna 106, and an encapsulating material 108. The die 102 may includeany suitable structure configured as a miniaturized circuit on asuitable die substrate, and is functionally equivalent to a componentalso referred to as a “chip” or an “integrated circuit (IC).” The diesubstrate may be formed using any suitable semiconductor material, suchas, but not limited to, silicon. The die 102 may be mounted inelectrical communication with the lead frame. The lead frame (similar to218 of FIG. 2) may be any suitable arrangement of electricallyconductive leads configured to allow one or more other circuits tooperatively connect with the die 102. The leads of the lead frame (See218 of FIG. 2) may be embedded or fixed in a lead frame substrate. Thelead frame substrate may be formed using any suitable insulatingmaterial configured to substantially hold the leads in a predeterminedarrangement.

Further, the electrical communication between the die 102 and leads ofthe lead frame may be accomplished by any suitable method usingconductive connectors such as, one or more bond wires 104. The bondwires 104 may be used to electrically connect points on a circuit of thedie 102 with corresponding leads on the lead frame. In anotherembodiment, the die 102 may be inverted and conductive connectorsincluding bumps, or die solder balls rather than bond wires 104, whichmay be configured in what is commonly known as a “flip chip”arrangement.

The antenna 106 may be any suitable structure configured as a transducerto convert between electrical and electromagnetic signals. The antenna106 may be configured to operate in an EHF spectrum, and may beconfigured to transmit and/or receive electromagnetic signals, in otherwords as a transmitter, a receiver, or a transceiver. In an embodiment,the antenna 106 may be constructed as a part of the lead frame (see 218in FIG. 2). In another embodiment, the antenna 106 may be separate from,but operatively connected to the die 102 by any suitable method, and maybe located adjacent to the die 102. For example, the antenna 106 may beconnected to the die 102 using antenna bond wires (similar to 220 ofFIG. 2). Alternatively, in a flip chip configuration, the antenna 106may be connected to the die 102 without the use of the antenna bondwires (see 220). In other embodiments, the antenna 106 may be disposedon the die 102 or on the PCB 116.

Further, the encapsulating material 108 may hold the various componentsof the EHF communication chip 114 in fixed relative positions. Theencapsulating material 108 may be any suitable material configured toprovide electrical insulation and physical protection for the electricaland electronic components of first EHF communication chip 114. Forexample, the encapsulating material 108 may be a mold compound, glass,plastic, or ceramic. The encapsulating material 108 may be formed in anysuitable shape. For example, the encapsulating material 108 may be inthe form of a rectangular block, encapsulating all components of the EHFcommunication chip 114 except the unconnected leads of the lead frame.One or more external connections may be formed with other circuits orcomponents. For example, external connections may include ball padsand/or external solder balls for connection to a printed circuit board.

Further, the EHF communication chip 114 may be mounted on a connectorPCB 116. The connector PCB 116 may include one or more laminated layers112, one of which may be PCB ground plane 110. The PCB ground plane 110may be any suitable structure configured to provide an electrical groundto circuits and components on the PCB 116.

FIG. 2 is a perspective view of an EHF communication chip 214 showingsome internal components. It is noted that FIG. 2 portrays the EHFcommunication chip 214 using computer simulation graphics, and thus somecomponents may be shown in a stylized fashion. As illustrated, the EHFcommunication chip 214 can include a die 202, a lead frame 218, one ormore conductive connectors such as bond wires 204, a transducer such asantenna 206, one or more antenna bond wires 220, and an encapsulatingmaterial 208. The die 202, the lead frame 218, one or more bond wires204, the antenna 206, the antenna bond wires 220, and the encapsulatingmaterial 208 may have functionality similar to components such as thedie 102, the lead frame, the bond wires 104, the antenna 106, theantenna bond wires, and the encapsulating material 108 of the EHFcommunication chip 114 as described in FIG. 1. Further, the EHFcommunication chip 214 may include a connector PCB (similar to PCB 116).

In FIG. 2, it may be seen that the die 202 is encapsulated in the EHFcommunication chip 214, with the bond wires 204 connecting the die 202with the antenna 206. In this embodiment, the EHF communication chip 214may be mounted on the connector PCB. The connector PCB (not shown) mayinclude one or more laminated layers (not shown), one of which may bePCB ground plane (not shown). The PCB ground plane may be any suitablestructure configured to provide an electrical ground to circuits andcomponents on the PCB of the EHF communication chip 214.

With continuing references to FIGS. 1-2, the EHF communication chip 214may be included and configured to allow EHF communication with the EHFcommunication chip 114. Further, either of the EHF communication chips114 or 214 may be configured to transmit and/or receive electromagneticsignals, providing one or two-way communication between the EHFcommunication chip 114 and the EHF communication chip 214 andaccompanying electronic circuits or components. In an embodiment, theEHF communication chip 114 and the EHF communication chip 214 may beco-located on the single PCB and may provide intra-PCB communication. Inanother embodiment, the EHF communication chip 114 may be located on afirst PCB (similar to PCB 116) and the EHF communication chip 214 may belocated on a second PCB (similar to PCB 116) and may therefore provideinter-PCB communication.

Regardless of where the EHF communication chips 114 and 214 are mounted,it remains important to provide improved signal security and integritywhen communicating between any two EHF communication chips. One methodfor enhancing or ensuring proper signal security and integrity is toverify that the EHF communication chip 214 is within a predeterminedrange before or during a communication attempt. To that end, systems andmethods for detecting the presence of the EHF communication chip 214and/or for ensuring another device or surface is within a certaindistance may be included. Examples of such systems and methods aredescribed in U.S. Provisional Patent Application Ser. No. 61/497,192,which is hereby incorporated in its entirety for all purposes.

FIG. 3 is a block diagram illustrating system elements of an extremelyhigh frequency communication chip 314, in accordance with an embodimentof the present disclosure. The EHF communication chip 314 is configuredto transmit or/and receive EHF signals. As shown, the EHF communicationchip 314 may include an EHF communication circuit 302, a test and trimcircuit 304 and an antenna 306. The structure and system elements of theEHF communication chip 314 are already described in detail in FIGS. 1-2.

The EHF communication circuit 302 may be configured to convert betweenmodulated digital signals and demodulated digital signals at or near adesired EHF frequency, or within a preselected range of EHF frequencies.Alternatively, or in addition, the EHF communication circuit 302 may beconfigured to modulate a digital signal into a modulated EHF signalhaving a desired emissions level, or an emissions level falling within apreselected range of emissions levels, or to demodulate a modulated EHFsignal having a preselected emissions level into a digital signal. TheEHF communication circuit 302 may include at least one controllableparameter-based module having a testable and controllable operatingparameter. In one embodiment of the invention the controllableparameter-based module is configured to control an emissions level ofthe EHF communication circuit. In an alternative embodiment of theinvention, the EHF communication circuit 302 is configured to operatewithout an input from an external reference clock. The antenna 306 iscoupled to the EHF communication circuit and may be configured totransduce between electrical signals and electromagnetic signals at adesired EHF frequency. The test and trim circuit may be coupled to theEHF communication circuit 302. The system elements of the test and trimcircuit 304 are described in detail in subsequent FIGS. 4-5.

Turning to FIG. 4, a functional block diagram is depicted showingvarious components of a test and trim circuit 406 (or 304 of FIG. 1).The test and trim circuit 406 may be incorporated entirely or partiallyon the die 102 of the EHF communication chip 114, and may include atest-and-trim control circuit 402 external to the EHF communication chip114, a number of input and output (I/O) ports 404A-N, which provide aninterface for communication between the test-and-trim control circuit402 and a logic circuit or circuits 408. The logic circuit 408 mayinclude a non-volatile memory 412 and a temporary data register 414. Asdiscussed with reference to FIG. 3, the logic circuit 408 may be coupledto the controllable parameter-based module having a testable andcontrollable operating parameter. The logic circuit 408 may be incommunication with one or more controllable parameters 416A-N, such aspower level, amplifier gain, and/or oscillator frequency.

In one embodiment of the invention, the test and trim circuit 406 mayinclude a memory circuit coupled to the EHF communication circuit, wherethe memory circuit is configured to control the controllable operatingparameter of the EHF communication circuit. The test and trim circuitmay further include a test circuit coupled to the at least onecontrollable parameter-based module, where the test circuit isconfigured to monitor the operation of the controllable parameter-basedmodule.

The test and trim circuit 406 may further include an interfaceconfigured to operatively connect an external control circuit (See FIG.5) to the logic circuit 408. The external control circuit may beconfigured to control operation of the test and trim circuit 406. Theinterface may include various I/O ports 404A-N that can incorporate anyof a number of conventional input/output pins or tabs or other physicalinterfaces for connecting an external device incorporating the externalcontrol circuit, in order to control the operation of test and trimcircuit 406 by providing a signal to, or receiving a signal from thecircuit. For example, the EHF communication chip 114 (or 214) may bemounted on a test board, which may be operatively connected to the testand trim circuit 406 through the I/O ports 404A-N. The I/O ports 404A-Nmay provide communication with the logic circuit 408.

The logic circuit 408 in turn may include, for example, an interfacelogic circuit 410 for interfacing with the non-volatile memory 412 andthe temporary data storage component such as, but not limited to, thetemporary storage register 414. The interface logic circuit 410 may beconfigured as a serial peripheral interface bus (SPI), or may utilizesome other communication mode. The interface logic circuit 410 mayprovide a route for externally controlling digital information stored inthe temporary storage component or register 414 and in the non-volatilememory 412. In one embodiment, the logic circuit 405 is configured tocopy stored content from non-volatile memory 412 to the temporarystorage register 414.

The logic circuit 408 may be configured to determine a desired oroptimal setting for one or more of the controllable operating parameters416, and to permanently fix that operating parameter at the desiredsetting. Any suitable method for permanently setting an operatingparameter of the EHF communication circuit is an appropriate method forthe purposes of the present invention. For example, the non-volatilememory 412 may include one or more selectively blowable fuses (notshown), the state of which may determine a setting for one or more ofthe controllable parameters 416. A parameter value may be stored in thenon-volatile memory by selectively blowing one or more of the fuses. Aseparate portion of the non-volatile memory 412 may be dedicated to eachof the controllable parameters.

Both temporary data storage component 414 and non-volatile memory 412may each be in communication with at least one controllableparameter-based module (not shown) of the EHF communication circuit (See302 of FIG. 3). Accordingly, either component 412 or 414 may control anygiven parameter. As described below, this arrangement allows testing ofvarious settings as well as experimentation after a final setting hasbeen selected.

FIG. 5 depicts a more specific example of a portion of a test and trimcircuit 500 (or 406 of FIG. 4) at least a portion of which may beresident on the EHF communication chip, generally indicated as 536 inthis figure. The EHF communication chip 536 may include an EHFcommunication circuit (See FIG. 3), a test and trim circuit 500 and anantenna (See FIG. 3). The EHF communication circuit may include at leastone controllable parameter-based module having an associated testableand controllable operating parameter. Further, the test and trim circuit500 may be part of a system for constraining an operating parameter ofan EHF communication chip 114. The system may include a test and trimrig 502 including an external control circuit 534. The external controlcircuit 534 may be configured to control operation of the test and trimcircuit 500. The test and trim rig 502 may be operatively connected tothe interface of the EHF communication chip (i.e. 114 or 214).

In this example, various I/O interface ports 504 are provided, allowingan external control circuit 534 to physically interface with aninterface logic circuit 506. The interface logic circuit 506 may be anSPI interface logic circuit, and may be in communication with one ormore temporary data storage components, such as trim register(s) 514,and a non-volatile memory 512. The trim register(s) 514 and non-volatilememory 512 may in turn feed a multiplexer (MUX) 522, the operation ofwhich may be controlled by interface logic circuit 506 to select whichmemory component signal is passed through the multiplexer 522. The MUX522 may be configured to select between the trim register(s) 514 and thenon-volatile memory 516, placing the selected memory component incommunication with the one or more controllable parameters (See 416A-Nin FIG. 4).

Further, the test and trim circuit 500 may further include an interfaceconfigured to operatively connect an external control circuit to theinterface logic circuit 506. In one embodiment of the invention, thefrequency of signal is testable and controllable by the external controlcircuit 534 in the absence of the reference clock or reference counter518. In addition, an operating parameter of the EHF communicationcircuit (302 of FIG. 3) can be tested and controlled by the externalcontrol circuit 534 in the absence of a reference clock or referencecounter 518. The operating parameter is controlled by a signal that isrepresentative of a parameter value stored in one of the non-volatilememory 512 and a temporary data register 516. The non-volatile memory512 may further include a number of fuses, and a parameter value may bestored in the non-volatile memory 512 by selectively blowing one or moreof the fuses.

The at least one controllable parameter-based module may include any ofa variety of chip-based modules that may alter the operation of the EHFcommunication circuit in a detectable way. Typically, the controllableparameter-based module is selected from those modules that effect one ormore aspects of the modulation, transmission, reception, or demodulationof an EHF signal by the EHF communication circuit.

In one embodiment of the invention, the controllable parameter-basedmodule may be configured to control the emissions level or transmitpower of the EHF communication circuit. In this embodiment, thecontrollable parameter-based module of the EHF communication circuit(See 304) may control a power amplifier (PA) 532 and the testable andcontrollable operating parameter of the PA 532 may be a transmit power.

Alternatively, or in addition, the controllable parameter-based moduleof the EHF communication circuit may be configured to control the signalfrequency, or carrier frequency, of the EHF communication chip, such aswhere the controllable parameter-based module of the EHF communicationcircuit (See 304) includes an electronic oscillator, such as avoltage-controlled oscillator (VCO) 524. In this embodiment, thetestable and controllable operating parameter of the voltage-controlledoscillator 524 may be a carrier frequency.

Typically, the controllable parameters may include, for example, thegeneration of a signal having a frequency by a voltage-controlledoscillator 524, a power level of a signal output by the power amplifier(PA) 532, and/or a gain level associated with a low-noise amplifier(LNA) 526. Further, the at least one controllable parameter-based modulemay include the LNA 526 and the testable and controllable operatingparameter of the LNA 526 may be a gain level. Additionally, the VCO 524and the PA 532 may be part of a larger circuit that accepts an inputsignal TX from a transmission circuit (not shown) and passes that signalto a shared antenna 538. Likewise, the LNA 528 may be part of a largercircuit that accepts a received signal from the antenna 538 and passesit as an amplified signal RX on to a reception circuit (not shown).Accordingly, the test and trim circuit 500 may act in concert with or asa portion of a functioning transceiver circuit.

The at least one controllable parameter-based module may include a poweramplifier (PA) 532 and the testable and controllable operating parameterof the PA 532 may be an emissions level. The at least one controllableparameter-based module of the EHF communication circuit (See 304) mayinclude a voltage-controlled oscillator (VCO) 524. Further, the testableand controllable operating parameter of the voltage-controlledoscillator 524 may be a carrier frequency. The controllable parametersmay include, for example, the generation of a signal having a frequencyby a voltage-controlled oscillator 524, a power level of a signal outputby the power amplifier (PA) 532, and/or a gain level associated with alow-noise amplifier (LNA) 526. Further, the at least one controllableparameter-based module may include the LNA 526 and the testable andcontrollable operating parameter of the LNA 526 may be a gain level.Additionally, the VCO 524 and the PA 532 may be part of a larger circuitthat accepts an input signal TX from a transmission circuit (not shown)and passes that signal to a shared antenna 538. Likewise, the LNA 528may be part of a larger circuit that accepts a received signal from theantenna 538 and passes it as an amplified signal RX on to a receptioncircuit (not shown). Accordingly, the test and trim circuit 500 may actin concert with or as a portion of a functioning transceiver circuit.

With continuing reference to FIG. 5, various components may be includedin test and trim circuit 500 to facilitate measurement and adjustment ofthe one or more controllable parameter-based module(s) previouslydiscussed. For example, external test and trim control rig 502 mayprovide a standard clock signal to drive a reference counter 518, whilean actual counter 520 may be driven by the output of VCO 526. Thereference counter 518 and the actual counter 520 may be compared by afirst comparison circuit 508, which may provide the results of thatcomparison to the interface logic circuit 506. Accordingly, the externaltest and trim control rig 502 may have access to the comparison resultsvia the I/O ports 504. In one embodiment of the invention, external testand trim control rig 502 may provide a standard clock signal in order tofacilitate the adjustment of one or more controllable parameter-basedmodules, which modules would subsequently be capable of operationwithout the necessity of a reference clock. For example, VCO 526, oncecalibrated, may not require a signal from a reference clock, but mayrely upon one or more stored settings.

Likewise, the interface logic circuit 506 may be in communication withanother temporary register 516 that drives a digital-to-analog converter(DAC) 536. The DAC 536 may provide a resulting analog signal to areplica detector 528, which may measure a value of the provided signal.An actual detector 530 may detect a power or gain parameter value at aport of the antenna 538, and may communicate that value to a secondcomparison circuit 510, where it may be compared to the value detectedby the replica detector 528. The results of the comparison may be madeavailable to the test and trim rig 502 via the interface logic circuit506 and the I/O ports 504.

Based on the results of these comparisons, one or more of the parametersof the controllable parameter-based module(s) may be adjusted bychanging values stored in the trim register(s) 514 until acceptablecomparison results are achieved based on predetermined criteria. At thatpoint, a known acceptable setting exists, and the parameter-basedfunction may have a permanent setting entered by causing thenon-volatile memory 512 to contain the same value. The MUX 522 may thenbe dynamically configured to selectively place the non-volatile memory512 in communication with the at least one controllable parameter-basedmodule.

It is noted, however, that the parameter-based function in questionremains in potential communication with both the trim register(s) 514and the non-volatile memory 512 via MUX 522. Through this mechanism, atleast two channels of control are possible for each of the controllableparameter-based functions. This may allow temporary control of acontrollable parameter for processes such as testing andexperimentation, while also providing a more permanent setting of theparameter via the non-volatile memory. Because the MUX 522 remains incommunication with both the temporary trim register(s) 514 and thenon-volatile memory 512 even after a permanent setting has beenestablished, the testing and experimentation options remain available.

Turning to FIGS. 6A-6B, a test and trim method, generally indicated at600, is described that may utilize a test and trim circuit 500. Themethod 600 may be implemented during manufacture of EHF communicationchips to ensure uniformity of manufacture and to establish qualitycontrol and assurance. In general, method 600 may be used to test EHFcomm-link chips and account for issues such as natural variation bytrimming certain parameters to match reference values within anacceptable tolerance level.

At step 602, a reference value for the given parameter is determined.This may be accomplished by any suitable means. For example, a referencevalue for a frequency generated by an oscillator may be provided by areference counter. In one embodiment of the invention, the referencevalue corresponds to a discrete value, such as a selected carrierfrequency, or a selected emissions level. Alternatively, the referencevalue may correspond to a range of acceptable values, such as a range ofcarrier frequencies, or a range of emissions levels.

At step 604, an actual performance for the parameter based function inquestion is determined. In the example of a frequency, a signal outputfrom a frequency-controlled oscillator on an EHF communication chip maybe input to a second counter in order to provide a value indicatingactual performance.

At step 606, the actual performance is compared with the referencevalue. At step 608, it is checked whether the actual performance isgreater than or equal to the reference value. Alternatively, or inaddition, the actual performance may be compared with a reference valuethat is a discrete value, or the actual performance may be compared withan acceptable range of reference values, to determine if the actualperformance lies within the acceptable range. In yet another embodiment,the actual performance is compared to a single reference value, and thedifference between the actual performance and the reference value isdetermined. At step 608, a determination may be made regarding theacceptability of the comparison of step 606. If the actual performanceis outside a predefined tolerance level relative to the reference level,the comparison may indicate that the actual performance is notacceptable. If it is not acceptable, then at step 614 a temporarycontrol setting may be adjusted to alter the actual performance. Thistemporary control setting may be accomplished using, for example, thetemporary data storage registers (See 516) of test and trim circuit(i.e. 500) previously described in FIG. 5. Because excessive adjustmentof the setting may not be desirable, and may exceed the capabilities ofthe test and trim circuit to modify the subject parameter, and/or mayindicate a faulty part, step 616 may include comparing the settingadjustment to a threshold value. The threshold value may define amaximum allowable or available adjustment level. If the adjustmentsetting is either greater than or equal to the threshold value then, thepart may be rejected at step 618. If not at step 616, then the actualperformance is again analyzed in step 604.

If step 608 instead results in a favorable determination, the settingfor the parameter in question may be considered to be adequate.Accordingly, in step 610, a permanent control setting may be setcorresponding to the temporary setting that has been determined to beacceptable. This may be accomplished by, but is not limited to,selectively blowing predetermined fuses in a non-volatile memory such asnon-volatile memory (i.e. 512), previously described in FIG. 5. Oncethis setting has been established, the actual performance may again bechecked in step 612. A comparison is again made in step 620 to determineacceptability, and the part is either accepted at step 622 or rejectedat step 618 based on that determination.

The present disclosure also provides a method including providing an EHFcommunication chip with a parameter capable of being controlled by atemporary digital setting and by a permanent digital setting. The methodmay include comparing an actual value of the parameter to a referencevalue of the parameter. The method may further include adjusting thetemporary digital setting to alter the actual value of the parameteruntil the difference between the actual value and the reference value isacceptable in response to an unacceptable difference between the actualvalue of the parameter and the reference value of the parameter. Themethod may also include causing the permanent digital setting to containa value corresponding to the adequate setting in response to determiningthat a temporary digital setting is adequate. The method may also allowthe temporary digital setting to remain selectable in control of theparameter after the permanent digital setting is set to a value.Further, an EHF communication chip may be provided with a parameter byproviding the EHF communication chip with a function having acontrollable frequency as a parameter. Similarly, comparing an actualvalue of the parameter to a reference value of the parameter may includecomparing a value of a first counter slaved to the frequency parameterto a value of a second counter used as a reference. In an embodiment,providing an EHF communication chip with a parameter includes providingan EHF communication chip with a power parameter. Also, comparing anactual value of the power parameter to a reference value includescomparing a signal strength value detected by a first detector connectedto an antenna port to a reference value from a second detectorconfigured as a replica detector.

In another embodiment, providing the EHF communication chip with aparameter includes providing an EHF communication chip with a functionhaving a controllable gain as a parameter and comparing an actual valueof the parameter to a reference value of the parameter includescomparing a signal strength detected by a first detector connected to anantenna port to a reference value from a second detector configured as areplica detector. The EHF communication chip may include insulatingmaterial, a chip having an integrated circuit (IC), and an antenna thatcommunicates with the IC and is held in a fixed location by theinsulating material.

The present disclosure also provides a method that includes the step ofoperating a function of an EHF communication chip, where functionoperation is characterized by a parameter having an actual valuedetermined by a value of a temporary parameter and a permanentparameter. The method may include comparing an actual value of theparameter with a reference value of the parameter, and determiningwhether the actual value of the parameter is acceptable based on thecomparison of the actual value of the parameter with the reference valueof the parameter. If the actual value of the parameter is determined tobe unacceptable, then a value of a temporary parameter may be adjusteduntil the actual value is determined to be acceptable. The method mayalso include setting a permanent parameter to a value representative ofthe value of the temporary parameter for which the actual value of theparameter is acceptable.

The present disclosure also provides a calibrated reference-less EHFcommunication system, configured to operate at a predetermined carrierfrequency, or within a range of predetermined carrier frequencies. Thecalibrated reference-less EHF communication system may include an EHFcommunication circuit, a test and trim circuit coupled to the EHFcommunication circuit, and a memory circuit coupled to the test and trimcircuit.

The present disclosure also provides a calibrated reference-less EHFcommunication system, configured to operate at a predetermined carriersignal energy, or within a range of predetermined carrier signalenergies. The calibrated reference-less EHF communication system mayinclude an EHF communication circuit, a test and trim circuit coupled tothe EHF communication circuit, and a memory circuit coupled to the testand trim circuit.

The present disclosure may further provide an EHF communication systemthat includes a reference-less oscillator that is configured to generatea carrier signal, where the generated carrier signal has a predeterminedcarrier frequency, or predetermined range of carrier frequencies. ThisEHF communication system may further include a test and trim circuitoperatively coupled to the reference-less oscillator, where the test andtrim circuit may be configured to calibrate the carrier frequency towithin the predetermined range of carrier frequencies, and a storageelement coupled to the test and trim circuit, which is in turnconfigured to store a value associated with the calibration.

The present disclosure may yet further provide an EHF communicationsystem that includes a transmitter configured to transmit at apredetermined carrier signal energy level or predetermined range ofcarrier signal energy levels, the EHF communication system additionallyincluding a test and trim circuit that is operatively coupled to thetransmitter, where the test and trim circuit is configured to calibratethe transmitted carrier signal energy level to within the predeterminedrange of carrier signal energy levels, and a storage element coupled tothe test and trim circuit, where the storage element may be configuredto store a value associated with the calibration.

The present disclosure may yet further provide an EHF communicationsystem that includes an EHF receiver configured to receive a transmittedEHF signal, where the EHF receiver is configured to detect apredetermined carrier signal energy level, or predetermined range ofcarrier signal energy levels. The EHF communication system may furtherinclude a test and trim circuit operatively coupled to the receiver,where the test and trim circuit may be configured to calibrate thedetection of the carrier signal energy level to within the predeterminedrange of carrier signal energy levels, and a storage element coupled tothe test and trim circuit, where the storage element is configured tostore a value associated with the calibration.

It is believed that the disclosure set forth herein encompasses multipledistinct inventions with independent utility. While each of theseinventions has been disclosed in its preferred form, the specificembodiments thereof as disclosed and illustrated herein are not to beconsidered in a limiting sense as numerous variations are possible. Eachexample defines an embodiment disclosed in the foregoing disclosure, butany one example does not necessarily encompass all features orcombinations that may be eventually claimed. Where the descriptionrecites “a” or “a first” element or the equivalent thereof, suchdescription includes one or more such elements, neither requiring norexcluding two or more such elements. Further, ordinal indicators, suchas first, second or third, for identified elements are used todistinguish between the elements, and do not indicate a required orlimited number of such elements, and do not indicate a particularposition or order of such elements unless otherwise specifically stated.

What is claimed is:
 1. An integrated circuit device comprising: anextremely high frequency (EHF) communication circuit configured tooperate independent of external reference clock; a test and trim circuitcoupled to the EHF communication circuit, the test and trim circuitconfigured to determine a setting for a carrier frequency value of anoscillator included in the EHF communication circuit within apredetermined range of carrier frequencies; and a storage elementcoupled to the test and trim circuit, the storage element configured tostore the setting of the carrier frequency of the oscillator.
 2. Theintegrated circuit of claim 1, wherein the test and trim circuit isfurther configured to provide the stored setting of the carrierfrequency to a control circuit coupled to the EHF communication circuitvia a control interface.
 3. The integrated circuit of claim 1, whereinthe test and trim circuit is further configured to: determine an actualvalue of the carrier frequency of the oscillator; compare the actualvalue of the carrier frequency with the stored setting of the carrierfrequency; and determine whether to modify the stored setting of thecarrier frequency based on the comparison.
 4. The integrated circuit ofclaim 1, wherein the test and trim circuit is further configured to sendinformation indicating a determination of whether to modify the storedsetting of the carrier frequency of the oscillator to the controlcircuit via the control interface.
 5. The integrated circuit of claim 3,wherein the control circuit is further configured to modify the storedsetting of the carrier frequency of the oscillator by a specifiedadjustment value when the comparison indicates that the actual value ofthe carrier frequency of the oscillator exceeds a tolerance level. 6.The integrated circuit of claim 5, wherein the control circuit isfurther configured to: compare the specified adjustment value to anadjustment threshold; receive an adjusted actual value of the carrierfrequency of the oscillator from the test and trim circuit; and receiveupdated information describing a comparison of the modified storedsetting of the carrier frequency of the oscillator and the adjustedactual value of the carrier frequency.
 7. The integrated circuit ofclaim 6, wherein the control circuit is further configured to receive anindication that the modified stored setting of the carrier frequency isstored in a non-volatile memory component included in the EHFcommunication circuit when the comparison between the specifiedadjustment value and the adjustment threshold satisfies a targetparameter tolerance level.
 8. The integrated circuit of claim 7, whereinthe non-volatile memory component further comprises a plurality offuses, and the modified stored setting of the carrier frequency isstored in the non-volatile memory component by selectively blowing oneor more of the plurality of fuses.
 9. The integrated circuit of claim 2,wherein the control circuit is further configured to receive anindication that the stored setting of the carrier frequency is stored ina non-volatile memory component included in the EHF communicationcircuit when the comparison between actual value of the carrierfrequency of the oscillator with the stored setting of the carrierfrequency satisfies a target parameter tolerance level.
 10. Theintegrated circuit of claim 9, wherein the non-volatile memory componentfurther comprises a plurality of fuses, and the stored setting of thecarrier frequency is stored in the non-volatile memory component byselectively blowing one or more of the plurality of fuses.
 11. Theintegrated circuit of claim 2, wherein the control circuit is furtherconfigured to receive an indication that the stored setting of thecarrier frequency of the oscillator is stored in a temporary storageregister included in the EHF communication circuit.
 12. The integratedcircuit of claim 11, wherein the temporary storage register is thestorage element.